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CGB 240 Datasheet
2-Stage Bluetooth InGaP HBT Power Amplifier
Description:
The CGB240 GaAs Power Amplifier MMIC has been especially developed for wireless applications in the 2.4 - 2.5 GHz ISM band (e.g. Bluetooth class 1). Its high power added efficiency and single positive supply operation makes the device ideally suited to handheld applications. The device delivers 23 dBm output power at a supply voltage of 3.2 V, with an overall PAE of 50%. The output power can be adjusted using an analog control voltage (VCTR). Simple external input-, interstage-, and output matching circuits are used to adapt to the different requirements of linearity and harmonic suppression in various applications. For WLAN applications (IEEE802.11b) or applications serving both WLAN and Bluetooth, we recommend to use the CGB240B device.
Applications:
* Bluetooth Class 1 * Cordless Phones * Home RF
Features:
* Single voltage supply. * Wide operating voltage range 2.0 - 5.5 V. * POUT = 23 dBm at VC = 3.2 V. * Overall power added efficiency (PAE) typically 50%. * High PAE at low-power mode. * Analog power control with four power steps. * Straight-Forward Matching; Few external components.
Package Outline:
1
5 TSSOP-10-2 MSOP-10
Pin Configuration: 1 & 2: 3: 4, 5, & 10: 6: 7: 8 & 9: 11 (Paddle): Vc1 RF In NC Vcntrl1 Vcntrl2 Vc2 GND
For further information please visit www.triquint.com
Rev. 1.6 October 20th, 2004
pg. 2/13
CGB 240 Datasheet
Absolute Maximum Ratings: Parameter
Supply voltage- CW Supply voltage- Pulsed Power control voltage DC supply current- Stage 1 DC supply current- Stage 2 Total Power Dissipation 2 RF Input Power RF Output Power
2 1
Symbol
Vcc Vcc Vapc Icc Icc PTOT PIN, MAX POUT, MAX Ta Ts
Min.
0 0 0 0 0
Max.
5.5 5.0 3.2 40.0 160.0 0.5 +10 +25 85 150
Units
Vdc Vdc V mA mA W dBm dBm C C
Operating case temperature Storage temperature
1 2
-20 -55
Thermal resistance between junction and pad 11 ( = heatsink ): RTHCH = 100 K/W. No RF input signal should be applied before turn-on of DC Power. An output VSWR of 1:1 is assumed.
Electrical Characteristics of CGB240 Device used in Bluetooth PA Reference Design (See Application Note 1) TA = 25 C; VCC = 3.2 V; f = 2.4 ... 2.5 GHz; ZIN = ZOUT = 50 Ohms
Parameter Symbol min
Supply Current Small-Signal Operation Power Gain Small-Signal Operation Output Power Power Step 1 Supply Current Power Step 1 Power Added Efficiency Power Step 1 ICC,SS GSS POUT,1 ICC,1 PAE 1 23
Limit Values typ
125 26 7 15 10
Unit
Test Conditions
max
150 mA dB dBm mA % PIN = - 10 dBm VCTR = 2.5 V PIN = - 10 dBm VCTR = 2.5 V PIN = + 3 dBm VCTR = 1.15 V PIN = + 3 dBm VCTR = 1.15 V PIN = + 3 dBm VCTR = 1.15 V
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Rev. 1.6 October 20th, 2004
pg. 3/13
CGB 240 Datasheet
Electrical Characteristics of CGB240 used in PA Reference Design (cont.)
Parameter Symbol Limit Values Min
Output Power Power Step 2 Supply Current Power Step 2 Power Added Efficiency Power Step 2 Output Power Power Step 3 Supply Current Power Step 3 Power Added Efficiency Power Step 3 Output Power Power Step 4 Supply Current Power Step 4 Power Added Efficiency Power Step 4 2nd Harm. Suppression Power Step 4 3rd Harm. Suppression Power Step 4 Turn-Off Current Off-State Isolation Rise Time 1 ) Rise Time 2 1) Fall Time 1 1) Fall Time 2 1) Maximum Load VSWR (no damage to device) allowed for 10s POUT,2 ICC,2 PAE 2 POUT,3 ICC,3 PAE 3 POUT,4 ICC,4 PAE 4 h2 h3 ICC,OFF S21,0 TR1 TR2 TF1 TF2 VSWR 40 22
Unit
Test Conditions
Typ
12 25 20 17 52 32 23 125 50 - 35 - 50 1 26
Max
dBm mA % dBm mA % 24 dBm mA % dBc dBc uA dB 1 1 1 1 6 s s s s PIN = + 3 dBm VCTR = 1.3 V PIN = + 3 dBm VCTR = 1.3 V PIN = + 3 dBm VCTR = 1.3 V PIN = + 3 dBm VCTR = 1.5 V PIN = + 3 dBm VCTR = 1.5 V PIN = + 3 dBm VCTR = 1.5 V PIN = + 3 dBm VCTR = 2.5 V PIN = + 3 dBm VCTR = 2.5 V PIN = + 3 dBm VCTR = 2.5 V PIN = + 3 dBm VCTR = 2.5 V PIN = + 3 dBm VCTR = 2.5 V VCC = 3.2 V; VCTR < 0.4 V; No RF Input PIN = + 3 dBm VCTR = 0 V VCC = 5.0 V VCTR = 0 to 1V Step VCC = 5.0 V VCTR = 0 to 3V Step VCC = 5.0 V VCTR = 1 to 0V Step VCC = 5.0 V VCTR = 3 to 0V Step PIN = + 5 dBm; VCC = 4.8 V; VCTR = 2.5 V ZIN = 50 Ohms
1) Rise time TR: time between turn-on of VCTR voltage until reach of 90% of full output power level. Fall time TF: as time between turn-off of VCTR voltage until reach of 10% of full output power level. Please note: Reduced Vccp,max for pulsed operation applies (see "absolute maximum ratings"). For further information please visit www.triquint.com
Rev. 1.6 October 20th, 2004
pg. 4/13
CGB 240 Datasheet
S-Parameters for Linear Small-Signal Operation TA = 25 C; VCC = 2.8 to 3.2 V; VCTR = 2.5 to 2.8 V; f = 2.4 ... 2.5 GHz PIN < - 4 dBm; Interstage match pin terminated with (1 + j 12.5) Ohms. Parameter (Target Data) Magnitude Input Reflection Phase Input Reflection Magnitude Forward Power Gain Magnitude Output Reflection ) Phase Output Reflection 2)
2 2) 2
Symbol MAG (S11) ANG (S11) MAG (S21) MAG (S12) MAG (S22) ANG (S22)
Typ. Value 0.67 + 180 20 - 47 0.59 + 147
Unit Degrees dB dB Degrees
Magnitude Reverse Power Gain )
) Measured for small signal conditions in pure 50 Ohm environment.
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Rev. 1.6 October 20th, 2004
pg. 5/13
CGB 240 Datasheet
Typical Device Performance for Reference Design (see Application Note 1) Valid for all plots: TA = 25 C; VCC = 3.2 V; VCTR = 2.5 V; f = 2.4 ... 2.5 GHz; ZIN = ZOUT = 50 Ohms. Changes from these values noted. Efficiency PAE = f ( VCC ) PIN = +3dBm
60,0 % 55,0
Output Power POUT = f ( VCC ) PIN = +3dBm
25,0 dBm 23,0
Power Added Efficiency PAE
50,0
45,0
Output Power Pout
V 5,0
21,0
19,0
40,0
35,0
17,0
30,0 2,0 3,0 4,0 Supply Voltage Vcc
15,0 2,0 3,0 4,0 Supply Voltage Vcc V 5,0
Supply Current ICC = f ( VCTR ) PIN = +3dBm
140,0 mA 120,0 Vcc=3.2V 100,0
Output Power POUT = f ( VCTR ) PIN = +3dBm
25,0 dBm 20,0 Vcc=2.8V Vcc=3.2V
15,0
Supply Current Icc
80,0 Vcc=2.8V 60,0
Output Power Pout
3,0
10,0
5,0
40,0
0,0
20,0
-5,0
0,0 1,0 1,5 Vctr 2,0 2,5 V
-10,0 1,0 1,5 Vctr 2,0 2,5 V 3,0
For further information please visit www.triquint.com
Rev. 1.6 October 20th, 2004
pg. 6/13
CGB 240 Datasheet
Output Power Compression POUT = f ( PCIN ) PIN = +3dBm
25,0 dBm Vcc=3.2V 20,0
Supply Current ICC = f ( TA ) PIN = +3dBm, Vcc = 3.2V
150 mA 140
Output Power Pout
15,0
Vcc=2.8V
Total Supply Current Icc
130
10,0
120
5,0
110
0,0 -20,0
100
-15,0 -10,0 -5,0 Input Power Pin 0,0 dBm 5,0
-40
-20 0 20 40 Ambient Temperature Ta
60
80 Deg C
Output Power POUT = f ( TA ) PIN = +3dBm
25 dBm 24 30 dB 28
Small-Signal Gain S21 = f ( TA ) PIN = -10 dBm, Vcc = 3.2V
Output Power Pout
23
26
22
SS Gain
-40 -20 0 20 40 Ambient Temperature Ta 60 80 Deg C
24
21
22
20
20 -40 -20 0 20 40 Ambient Temperature Ta 60 80 Deg C
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Rev. 1.6 October 20th, 2004
pg. 7/13
CGB 240 Datasheet
Pinning
1
5
MSOP-10
TSSOP-10
Figure 1
Pad
1 2 3 4 5 6 7 8 9 10 11
CGB240 Outline
Symbol
VC1 VC1 RFIN N.C. N.C. VCTR1 VCTR2 VC2 VC2 N.C. GND RF and DC ground (pad located on backside of package) Heatsink. Thermal resistance between junction - pad 11: RTHCH = 100 K/W. Control voltage 1st stage Control voltage 2nd stage Supply voltage of 2nd stage / RF output Supply voltage of 2nd stage / RF output
Function
Supply voltage of 1st stage / interstage match Supply voltage of 1st stage / interstage match RF input
Functional Diagram
(1,2) Vc1 (3) RFin
(8,9) Vc2 (11) Gnd (6) Vctr1 (7) Vctr2
Figure 2
CGB240 Functional Diagram
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Rev. 1.6 October 20th, 2004
pg. 8/13
CGB 240 Datasheet
Application Note 1: Bluetooth CGB240 PA Reference Design (TRL matching)
Vcc R1 C5 TRL2 CGB240 C1 RF In C4
5 11 6
C6 L1
TRL1
1
10
TRL3
C2 RF Out C3
C7
Vctr
Figure 3
Part
C1 C2 C3 ) C4 C5 C6 C7 L1 R1 TRL1 ) TRL2 TRL3
3 4) 4)
Schematic of Bluetooth CGB240 PA reference design.
Type
Cer. Capacitor Cer. Capacitor Cer. Capacitor Cer. Capacitor Cer. Capacitor Cer. Capacitor Cer. Capacitor Inductor Resistor Microstrip Line Microstrip Line Microstrip Line
Value
22 pF 22 pF 1.5 pF 2.2 pF 10 pF 1 F 1 nF 22 nH 10 R
Outline
0402 0402 0603 0402 0402 0603 0402 0603 0402
Source
Murata COG Murata COG AVX ACCU-P Murata COG Murata COG Murata X7R Murata X7R Toko Mira
Part No.
06035J1R5BBT
LL1608-FS
l = 2,5 mm; FR4 substrate; h = 0,2 mm; w = 0,32 mm l = 1,8 mm; FR4 substrate; h = 0,2 mm; w = 0,32 mm l = 4,0 mm; FR4 substrate; h = 0,2 mm; w = 0,32 mm
) Cost optimization might take place by using lower-Q AVX-CU capacitors instead of the AccuP version. This will lead to better h2 performance, however resulting in a loss of about 2% PAE. 4 ) Line length measured from corner of capacitor to end of MMIC's lead.
For further information please visit www.triquint.com
Rev. 1.6 October 20th, 2004
pg. 9/13
CGB 240 Datasheet
TriQuint Semiconductor, Inc.
R 1 C6 L1 C5
CGB240 C1 C 4
C 3
C2
White Dots" = Ground Vias
C7
RF Out (SMA)
Figure 4
Layout of Bluetooth CGB240 PA reference design using TRL matching (see application note 1).
Vc1 and Vc2 are connected together on the PCB. Vctr1 and Vctr2 are connected together on the PCB.
For further information please visit www.triquint.com
Rev. 1.6 October 20th, 2004
pg. 10/13
CGB 240 Datasheet
Application Note 2: Bluetooth Power Amplifier using Discrete Matching Vcc
C8 L1 L4 C1 RF In C4 C5
5 11 6
C6
CGB240
1 10
L2
L3
C2 RF Out C3
C7
Vctr Figure 5
Part
C1 C2 C3 C4 C5 C6 C7 C8 L1 L2 L3 L4
Bluetooth Amplifier using discrete matching.
Type
Cer. Capacitor Cer. Capacitor Cer. Capacitor Cer. Capacitor Cer. Capacitor Cer. Capacitor Cer. Capacitor Cer. Capacitor Inductor Inductor Inductor Inductor
Value
22 pF 22 pF 1.5 pF 2.0 pF 82 pF 0.1 F 1 nF 0.1 F 22 nH 1.0 nH 1.0 nH 22 nH
Outline
0402 0402 0603 0402 0402 0603 0402 0603 0603 0402 0402 0603
Source
Murata COG Murata COG AVX ACCU-P Murata COG Murata COG Murata X7R Murata X7R Murata X7R Toko Coilcraft Coilcraft Toko
Part No.
06035J1R5BBT
LL1005-FH22NJ 0402CS-1N0X_BG 0402CS-1N0X_BG LL1005-FH22NJ
For further information please visit www.triquint.com
Rev. 1.6 October 20th, 2004
pg. 11/13
CGB 240 Datasheet
TriQuint Semiconductor, Inc.
C6 C8 L4 C5 C1 C 4 L2 CGB240 L3 C 3 C2 L1
White Dots" = Ground Vias
C7
RF In (SMA)
RF Out (SMA)
Figure 6
Layout of CGB240 Bluetooth evaluation board used in application note 2.
For a discrete matching concept, the same evaluation board (V1.2) as shown in figure 5 might be used. However, to insert the series elements (L2, L3, L4), the pcb lines have to be cut mechanically. The use of a discrete matching concept saves pcb space but will lead to a lower output power (typ. 0.3dB lower) and higher BOM cost.
For further information please visit www.triquint.com
Rev. 1.6 October 20th, 2004
pg. 12/13
CGB 240 Datasheet
Description of MSOP-10 Package
In order to ensure maximum mounting yield and optimal reliability, special soldering conditions apply in volume production. Please ask for our information brochure on details or download the related document (TSSOP10_Soldering_Version01.pdf) from our website. The TSSOP-10-2 is a level 1 package. International standards for handling this type of package are described in the JEDEC standard J-STD-033 STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES", published May-1999. The original document is available from the JEDEC website www.jedec.org .
For further information please visit www.triquint.com
Rev. 1.6 October 20th, 2004
pg. 13/13
CGB 240 Datasheet
Part Marking:
Part Orientation on Reel:
Ordering Information:
Type
CGB240
Marking
CGB240
Package
MSOP-10
ESD: Electrostatic discharge sensitive device Observe handling precautions !
Additional Information
For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: info_wireless@tqs.com Tel: (503) 615-9000 Fax: (503) 615-8902
For technical questions and additional information on specific applications: Email: info_wireless@tqs.com
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright (c) 2003 TriQuint Semiconductor, Inc. All rights reserved. Revision 1.5-December 16, 2003
For additional information and latest specifications, see our website: www.triquint.com
pg. 14/14
CGB 240 Datasheet
Additional Information
For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: info_wireless@tqs.com Tel: (503) 615-9000 Fax: (503) 615-8902
For technical questions and additional information on specific applications: Email: info_wireless@tqs.com
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright (c) 2003 TriQuint Semiconductor, Inc. All rights reserved. Revision 1.5-December 16, 2003
For additional information and latest specifications, see our website: www.triquint.com
pg. 15/14

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